Method of metallizing a substrate of silica, quartz, glass or sapphire
AssigneeU.S. Philips Corporation
InventorJean-Paul Bourgeois-Moine
Life of this patent
Estimating the term…
Abstract
A method of adhering a metal to a surface of a substrate of silica, quartz, glass or sapphire is set forth. The surface to be metallized is first roughened by mechanical abrasion to obtain a roughness lying between 0.2 .mu.m and 0.7 .mu.m and is then subjected to a chemical treatment of etching by immersion in an aqueous solution of HF. According to the invention, the method further comprises the following steps of ion etching of the surface down to a depth less than 30 nm and then applying to the surface a first metallic adherence layer by cathode sputtering.
Claims13
A method of adhering a metal to a surface of a substrate of silica, quartz, glass or sapphire, in which the surface is first roughened by mechanical abrasion in order to obtain a surface roughness lying between 0.2 .mu.m and 0.7 .mu.m and is then subjected to a chemical treatment of etching by immersion in an aqueous hydrofluoric acid solution, characterized in that it further comprises the subsequent steps of ion etching (in a neutral medium) of the surface down to a depth smaller than 30 nm, and applying to the surface a first metallic adherence layer by cathode sputtering.
Dependencies are inferred from the claim text.