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US 4,945,400 AGranted
Subassembly for optoelectronic devices
AssigneeAT&T Bell Laboratories
InventorsGreg E. Blonder, Bertrand H. Johnson
Life of this patent
Estimating the term…
Abstract
A subassembly for use in packaging an optoelectronic device (e.g., LED or photodiode) includes a semiconductor (e.g., silicon) base and lid having a variety of etched features (e.g., grooves, cavities, alignment detents) and metalization patterns (e.g., contacts, reflectors) which enable the device to be reliably and inexpensively mounted on the base and coupled to the fiber.
Claims12
A subassembly for an optoelectronic device comprising
- a first member which is transparent to light transmitted between said device and the exterior of said subassembly, said device being mounted on one side of said first member,
- a semiconductor lid mounted on said one side of said first member and hermetically sealed thereto, said lid having a cavity therein for receiving said device,
- a semiconductor second member mounted on another side of said first member, said second member having a groove therein adapted to receive an optical fiber, said groove having side walls and an oblique end face formed by crystallographic planes, and
- a reflector disposed on said end face to direct light between said fiber and said device and through said first member.
1 more element
Dependencies are inferred from the claim text.