Liquid-cooled, flat plate heat exchanger

A one-piece, substantially flat and very thin heat exchanger core having two flat and parallel surfaces, each of said surfaces being suitable as a mounting surface for a number of heat producing electronic chips, said surfaces being closely spaced and separated by a single cavity for conveying a fluid coolant, said cavity containing a plurality of closely spaced pins extending the full distance between said parallel surfaces, said pins being formed and permanently joined to both of said parallel surfaces without creation of a seam, said pins being capable of having a hole installed through for their entire length, from one of said surfaces to the other, without breaching said fluid cavity and without creating a path for fluid to leak from said fluid cavity to the ambient, at least one electronic chip being mounted on one of said flat surfaces of said heat exchanger, and an accompanying printed circuit board being mounted to the other of said flat surfaces, with electrical connections being made between said chip and said printed circuit board by a multiplicity of conducting components extending through at least one of said pins.

A one-piece, substantially flat and very thin heat exchanger core having two flat and parallel surfaces, each of said surfaces being suitable as a mounting surface for a number of heat producing electronic chips, said surfaces being closely spaced and separated by a single cavity for conveying a fluid coolant, said cavity containing a plurality of closely spaced pins extending the full distance between said parallel surfaces, said pins being formed and permanently joined to both of said parallel surfaces without creation of a seam, said pins being capable of having a hole installed through for their entire length from one of said surfaces to the other, without breaching said fluid cavity and without creating a path for fluid to leak from said fluid cavity to the ambient, at least one chip being mounted on each of said flat surfaces of said heat exchanged, with electrical connections being made between said chips by a multiplicity of conducting components extending through at least one of said pins.

A method for creating a one-piece, very thin, substantially flat heat exchanger core having two flat and parallel surfaces, with each of said surfaces being suitable as a mounting surface for a number of heat producing electronic chips, said surfaces being closely spaced and separated by a single cavity for conveying a fluid coolant, and with said cavity containing a substantial number of seamless pins extending the full distance between said parallel surfaces, said method involving the steps of creating a mandrel having a pair of flat and parallel surfaces, with a substantial number of holes extending between said surfaces, applying metal to said mandrel surfaces and into the holes of said mandrel to such an extent as to completely encase said mandrel with a shell, machining said shell to the final dimensions desired for the heat exchanger core, exposing said mandrel at least at one location on said shell, and then removing said mandrel from the interior of said shell by a chemical etching process.

A method for creating a one-piece, very thin, substantially flat heat exchanger core having two flat and parallel surfaces, with each of said surfaces being suitable as a mounting surface for a number of heat producing electronic chips, said surfaces being closely spaced and separated by a single cavity for conveying a fluid coolant, and with said cavity containing a substantial number of pins extending the full distance between said parallel surfaces, at least one of said pins possessing a hole extending the full distance between said surfaces, said method involving the steps of creating a mandrel having a pair of flat and parallel surfaces, with a substantial number of holes extending between said surfaces, installing into the mandrel one or more hollow metal bushings with maskant therein, applying metal to said mandrel surfaces and to said bushings and into the holes of said mandrel to such an extent as to completely encase said mandrel with a shell, machining said shell to the final dimensions desired for the, heat exchanger core, exposing said mandrel at least at one location on said shell, and then removing said mandrel from the interior of said shell by a chemical etching process.