Alignment and exposure apparatus and method for manufacture of integrated circuits

An exposure method, for sequentially exposing at least two areas on a wafer to light, said method comprising the steps of:

• detecting surface-position information with respect to a first one of the at least two areas on the wafer, on the basis of distance information related to plural points on the wafer;
• changing the surface-position of the wafer in accordance with the result of detection so that the surface of the first area of the wafer is brought into a predetermined relation with a focus of exposure light;
• exposing the first area on the wafer to the exposure light;
• moving the wafer to a position for allowing exposure of a second one of the at least two areas on the wafer, and moving the surface position of the wafer, in accordance with a portion of said distance information which portion is related to one of said plural points on the wafer closest to the second area;
• detecting surface position information with respect to the second area on the wafer on the basis of distance information related to plural points on the wafer;
• changing the surface position of the wafer with respect to the second area so that the surface of the second area is brought into a predetermined relation with the focus of the exposure light;
• and
• exposing the second area of the wafer to the exposure light.

An exposure apparatus usable with a reticle and a wafer, for exposing the wafer to radiation passed through the reticle, said apparatus comprising:

• means for exposing the wafer to the radiation passed through the reticle;
• means for reading an identification mark formed on the reticle;
• means for recording an identification mark on the wafer;
• and
• means for reading an identification mark formed or recorded on the wafer.