Blade cutting method for hard brittle material
AssigneeApplied Magnetic Lab Co., Ltd.
InventorAkio Kuromatsu
Life of this patent
Estimating the term…
Loading patent…
AssigneeApplied Magnetic Lab Co., Ltd.
InventorAkio Kuromatsu
Estimating the term…
A method is provided for effectively and precisely cutting metals, ceramics, composite materials and the like by use of a blade having an elongated metal band body and a conductive abrasive layer adhered to a cutting edge thereof, with a first voltage difference selectively applied continuously or intermittently between the blade and an electrode disposed close to a side of the blade. A conductive processing fluid is supplied to a cutting portion between the blade and the workpiece and the first applied voltage is preferably applied to provide a negative pole on the blade side and a positive pole on the workpiece. Electrolytic, electro-discharge and grinding operations are thus provided simultaneously, to thereby permit rapid and precise cutting of hard, bittle and difficult-to-cut materials while maintaining the cutting effectiveness of the blade. In one aspect of this method, the blade is also provided with an insulation layer on at least a metal surface, and the cutting effects are thereby improved. In another aspect of this invention, an ultrasonic input is provided at the cutting position to further increase the cutting efficiency of the apparatus. In yet another aspect of the invention, a second power source is connected to the blade and the workpiece being cut thereby and a continuous or intermittent second voltage difference is selectively applied between the blade and the workpiece.
A method for cutting a hard workpiece with an elongate metal band blade maintained under tension and reciprocated with a longitudinal cutting edge pressed against the workpiece, comprising the steps of:
Dependencies are inferred from the claim text.