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US 4,924,203 AGranted
Wire bonded microfuse and method of making
AssigneeCooper Industries, Inc.
InventorLeon Gurevich
Life of this patent
Estimating the term…
Abstract
A microfuse (10) with a ceramic chip (12), thick film pads (14), fusible wire (16), attached to pads (14) without solder or flux, in an insulating enclosure or fuse tube (40). Ferrules (42) are attached to metallized areas (14) with solder (44). Performance and manufacturing of fuse (10) is improved by utilizing a wire bonding technique to improve the quality of the manufacturing process and increase the reliability of the fuse, and to reduce manufacturing cost.
Claims8
A fuse subassembly comprising:
- a flat insulating substrate;
- a first end of said substrate;
- a second end of said substrate;
- a metallized area on said first end and a metallized area on said second end of said substrate;
- a fusible element attached to said metallized areas in a manner not employing solder or flux;
- an enclosure, having a first end and a second end, said enclosure surrounding said substrate, metallized area, and fusible element;
- and,
- a ferrule attached to each of said metallized area and said ends of said enclosure.
5 more elements
Dependencies are inferred from the claim text.