Apparatus for forming leads of a semiconductor device

An apparatus for forming leads of a semiconductor device comprising:

• first mold half supporting means for supporting a first mold half;
• second mold half supporting means movable relative to said first mold half supporting means for supporting a second mold half opposite said first mold half;
• means for reciprocally moving said second mold half supporting means toward and away from said first mold half supporting means including:
• a crankshaft having an axis;
• means for rotating said crankshaft about its axis;
• a first coupling rod having opposed first and second ends and rotatably engaging the crankshaft at the first end;
• a coupler pivotally engaging the first coupling rod at its second end;
• a second coupling rod having opposed first and second ends and external threads between the first and second ends, the external threads threadedly engaging the second mold half supporting means and the first end of said second coupling rod rotatably engaging said coupler;
• and
• means for rotating said second coupling rod engaging said second coupling rod at its second end for adjusting the engagement of said second coupling rod with said second mold half supporting means along said second coupling rod whereby the minimum spacing between said first mold half supporting means and said second mold half supporting means is adjusted.