System for manufacturing semiconductor under clean condition

A system for manufacturing semiconductors under clean conditions comprising:

• a clean room having a floor, a ceiling and walls, said clean room being provided in a space surrounded by outer walls of a building, said clean room separating said space into a plurality of air circulating paths, said air circulating paths being disposed below, above and on the sides of the clean room;
• means for vertically partitioning said clean room into a medium cleanliness room and a high cleanliness room, said medium cleanliness room being cleaner than the space and the high cleanliness room being cleaner than the medium cleanliness room;
• first and second filters provided on the ceiling of the medium cleanliness room and the high cleanliness room, respectively, said first and second filters purifying the air flowing from the above air circulating path into the medium cleanliness room and the high cleanliness room;
• first and second exhausting openings provided at the floor of the medium cleanliness room and the high cleanliness room respectively for exhausting the air from said medium cleanliness room and said high cleanliness room into the below air circulating path;
• a first air-blower provided in the air circulating path on the side of said clean room;
• a third filter provided on a boundary between the air circulating path on the side of the clean room and the below air circulating path;
• a processing unit in the high cleanliness room;
• transport means for transporting workpieces comprising a robot having an accomodating carrier for avoiding dust and holding the workpieces and having a robot arm for moving said workpieces, which is disposed movably in the medium cleanliness room;
• a fourth filter provided on the ceiling of the accommodating carrier avoiding the dust, said fourth filter purifying the air flowing from the medium cleanliness room into said accommodating carrier;
• and
• communicating means to communicate between said medium cleanliness room and said high cleanliness room wherein said communicating means comprises an opening in said partitioning means for use of the robot arm through which a workpiece is transported to and from between the accommodating carrier and the processing unit.