US 4,922,376 A · Spring grid array interconnection for active microelectronic elements

Abstract

A mechanical and electrical interconnection of an active integrated circuit to a passive substrate. The interconnection includes a contact retainer having resilient elements disposed in apertures which extend through the retainer so that the elements are radially compressed. The retainer is disposed between the active integrated circuit and the passive substrate. The retainer may be secured either mechanically or through bonding agents to the active integrating circuit and the passive substrate. Axial compression of the resilient elements upon disposing the retainer between the active integrated circuit and the passive substrate provides for wiping action of the resilient elements on the contacts of the active integrated circuit and the passive substrate. The contact retainer may include thermal paths for heat dissipation of the integrated circuits to accommodate a higher density of integrated circuits.

Claims9

Dependent claims

A mechanical pressure contact providing electrical communication between an active circuit element and a passive substrate, comprising:

a module including at least one active element;
a contact retainer adapted to cooperatively align with said active element, said retainer including an aperture, said aperture exposed to an electrical contact on said active element upon cooperative alignment of said active element and said retainer;
a passive substrate having a surface terminal exposed to said aperture upon cooperative alignment of said retainer between said active element and said passive substrate;
a conductive resilient element disposed within said aperture, said element providing an electrical path through said retainer;
a lid sized to engage said module and enclose said active elements;
and
a fastener cooperatively aligning said retainer relative to said active element, said passive substrate, and said lid to deform said resilient element within its elastic limit and to secure said lid and said passive substrate.

4 more elements

Dependencies are inferred from the claim text.

Spring grid array interconnection for active microelectronic elements

Life of this patent

Spring grid array interconnection for active microelectronic elements

Life of this patent

Abstract

Claims9