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AssigneesMitsubishi Monsanto Chemical Company, Mitsubishi Kasei Corporation
InventorMasahiro Noguchi
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A substrate for a high-intensity LED and the method of epitaxially growing the substrate according to the invention are based on the fact that, in using an AuZn alloy or the like as the ohmic electrode of the p-type Al.sub.x Ga.sub.1-x As layer (2), the higher the carrier concentration of this layer, the smaller the contact resistance and the lower the applied voltage (V.sub.F) necessary for passing a forward current of 10 mA. Joint use is made of gas-phase epitaxy and liquid-phase epitaxy. A layer having a carrier concentration three to five times that of an epitaxial layer formed by liquid-phase epitaxy (LPE) can be realized with excellent reproducibility by gas-phase epitaxy (MOCVD process, MBE process, etc.). By utilizing this p-type Al.sub.x Ga.sub.1-x As layer (2) as an electrode contact layer, contact resistance can be reduced and variance diminished.
A method of epitaxially growing a substrate for a high-intensity LED, comprising a first step of forming a p-type Al.sub.x Ga.sub.1-x As layer (x>0.3) having a carrier concentration of more than 5.times.10.sup.17 cm.sup.-3 on a GaAs substrate to a thickness of 3-7 .mu.m by gas-phase epitaxy, a second step of forming a hetero structure epitaxial layer by liquid-phase epitaxy, and a third step of removing the GaAs substrate.
Dependencies are inferred from the claim text.