Multichip integrated circuit packaging method
AssigneeGeneral Electric Company
InventorsCharles W. Eichelberger, Robert J. Wojnarowski
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Abstract
A multichip integrated circuit package comprises a substrate to which is affixed one or more integrated circuit chips having interconnection pads. A polymer film overlying and bridging integrated circuit chips present is provided with a plurality of via openings to accommodate a layer of interconnection metallization which serves to connect various chips and chip pads within the interconnection pads disposed on the chips. A significant advantage of the packaging method and configuration of the present invention is the ability for the polymer film to be removed. This significantly improves testability and effectively provides wafer scale integration circuit packages which are free of problems associated with yield and testability.
Claims5
A method for packaging integrated circuit chips, said method comprising the steps of:
- disposing a plurality of integrated chips on a substrate, said chips including interconnection pads;
- applying a polymer film layer over said chips and said substrate so that said film bridges said chips in a manner to leave vacant space between said film and said substrate;
- providing a plurality of via openings in said polymer film, said openings being disposed over at least some of said interconnecting pads;
- and
- providing a pattern of electrical conductors on said film so said conductors extend between said via openings so as to electrically connect selected interconnection pads.
Dependencies are inferred from the claim text.