Apparatus for treating wafers with process fluids

Apparatus for wet processing of semiconductor wafers comprising:

• (a) vessel means for supporting said wafers in a closed circulation process stream wherein process fluids may sequentially flow past said wafers, said vessel means being hydraulically full with process fluid when said process fluids flow past said wafers and
• (b) means for supplying at least one cleaning fluid to said process stream for removing contaminants from said wafers, whereby said at least one cleaning fluid flows past said wafers without moving or handling said wafers.

Apparatus for wet processing of semiconductor wafers comprising:

• (a) vessel means for supporting said wafers in a closed circulation process stream wherein process fluids may sequentially flow past said wafers and
• (b) means for supplying at least one chemical reagent to said process stream for reacting with portions of said wafers, said process stream being positioned within said vessel means such that said vessel means is hydraulically full with process fluid.

Apparatus for wet processing of semiconductor wafers comprising:

• (a) vessel means for supporting said wafers in a closed circulation process stream wherein process fluids may sequentially flow past said wafers and
• (b) means for supplying at least one rinsing fluid to said process stream for removing other fluids from said wafers, means for minimizing gas/liquid interfaces in said rinsing fluid, said process stream being positioned within said vessel means such that said vessel means is hydraulically full with process fluid, whereby said at least one rinsing fluid flows past said wafers without moving or handling said wafers.