Amorphous silicon thin film transistor and method of manufacturing the same
AssigneesNippon Precision Circuits Inc., Seikosha Co., Ltd.
InventorsNoboru Motai, Yoshihisa Ogiwara, Yasunari Kanda
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Abstract
A method for manufacturing a amorphous silicon thin film transistor comprises exposing an morphous silicon layer situated between a source electrode and a drain electrode to a gas phase atmosphere having a gas containing an impurity forming an acceptor, then activating said impurity with an electric field or light energy and doping the activated impurity into said amorphous silicon layer. The gas may be a hydrogen compound and it may include an oxidizing gas.
Claims11
A method of manufacturing an amorphous silicon thin film transistor, comprising the steps of:
- exposing an amorphous silicon layer sandwiched between a gate electrode and source and drain electrodes, at a side thereof facing away from the gate electrode and which is exposed between said source electrode and said drain electrode, to a gas phase atmosphere at least having a gas containing an impurity forming an acceptor, the amorphous silicon layer being of a first conduction type and the acceptor being of a second different conduction type, and
- then activating said impurity with an electric field energy or light energy, thereby doping said activated impurity from said side of said amorphous silicon layer into said amorphous silicon layer.
A method of manufacturing an amorphous silicon thin film transistor, comprising the steps of:
- forming a gate electrode on an insulating substrate,
- forming a gate insulating layer on the gate electrode,
- forming an amorphous silicon layer on said gate insulating layer,
- forming a protective silicon layer on said amorphous silicon layer such that a portion of a side of said amorphous silicon which faces away from said gate electrode is exposed,
- forming a drain electrode and a source electrode on said protective silicon layer such that said portion of the side of said amorphous silicon layer remains exposed,
- exposing the exposed portion of the side of said amorphous silicon layer to a gas phase atmosphere at least having a gas containing an impurity forming an acceptor, the amorphous silicon layer being of a first conduction type and the acceptor being of a second different conduction type, and
- activating said impurity with electric field energy or light energy to thereby dope said activated impurity from said exposed portion of the side of said amorphous silicon layer into said amorphous silicon layer.
Dependencies are inferred from the claim text.