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US 4,912,288 AGranted
Moulded electric circuit package
AssigneeAllen-Bradley International Limited
InventorsAnthony Atkinson, Richard Gray, Oscar L. Denes
Life of this patent
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Abstract
A method of providing an electrical circuit wherein a carrier, which is a film of insulating plastic material with a circuit pattern thereon is supported in a mould and a moulding material is applied by the application of heat and pressure to provide a substrate so that the circuit is embedded in or within a three-dimensional surface of the moulded substrate.
Claims9
A moulded electrical circuit package wherein an entire support member is secured to a substrate comprising:
- a support member composed of a thin flexible film material having an electrically conductive circuit trace material disposed on one side of said support member;
- a substrate material for said flexible support member;
- and
- said substrate material and said flexible support member being fused directly together to form a unitary structure, with said support member and said substrate material defining distinct layers in said moulded circuit package and said electrically conductive circuit trace material being embedded in said thin flexible support member and flush with the surface thereof when disposed on a surface opposite said substrate material.
1 more element
Dependencies are inferred from the claim text.