Homoepitaxial growth of alpha-SiC thin films and semiconductor devices fabricated thereon
AssigneeNorth Carolina State University
InventorsHua-Shuang Kong, Jeffrey T. Glass, Robert F. Davis
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Abstract
Device quality monocrystalline Alpha-SiC thin films are epitaxially grown by chemical vapor deposition on Alpha-SiC [0001] substrates prepared off axis.
Claims21
A method of producing a device quality silicon carbide film on a silicon carbide substrate of the same polytype comprising:
- homoepitaxially depositing a film of an Alpha-SiC polytype on a prepared planar surface of an Alpha-SiC substrate, wherein the planar surface is inclined more than one degree off axis with respect to a basal plane thereof substantially towards one of the <1120>
- directions.
A method of producing a monocrystalline 6H SiC thin film homoepitaxially deposited on an off axis 6H SiC substrate, wherein the film is characterized by a smooth surface morphology, substantially uniform thickness and a low, device quality defect level, said method comprising:
- lapping a 6H SiC substrate crystal to expose a planar surface that is inclined more than one degree off axis with respect a basal plane thereof substantially towards one of the <1120>
- directions;
- preparing the off axis planar surface of the substrate to be receptive to epitaxial growth thereon;
- heating the substrate crystal in a growth chamber;
- introducing a carrier gas, a vaporized silicon-containing material and a vaporized carbon-containing material into the growth chamber while providing sufficient energy to create surface diffusion of silicon and carbon species at the substrate planar surface and establish a homoepitaxial growth of monocrystalline 6H SiC;
- and
- maintaining the carrier gas, silicon-containing material and carbon-containing material flows and the energy levels for a time sufficient to grow a film of desired thickness.
A method of producing a device quality silicon carbide film on a silicon carbide substrate, said method comprising:
- producing by sublimation a large, device quality Alpha-SiC single crystal;
- slicing the crystal to form wafers;
- preparing one of the wafers to establish a planar surface that is inclined more than one degree off axis with respect to a basal plane of the crystal substantially towards one of the <1120>
- directions;
- depositing a film of Alpha-SiC on the planar surface of the substrate.
Dependencies are inferred from the claim text.