US 4,911,519 AGranted

Packaging techniques for optical transmitters/receivers

AssigneeAT&T Bell Laboratories

InventorsWilliam H. Burton, Steven D. Robinson

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Abstract

Advanced packaging techniques are utilized to provide updated packaging for optical transmitters and receivers. In particular, the hybrid integrated circuit (HIC) used to form either the transmitter or receiver circuitry in the prior art has been replaced by a plastic dual-in-line package (DIP). The DIP includes specialized leads (prongs) formed through the short end of the DIP to provide direct connection to the optical device. These end-prong leads thus significantly decrease the parasitic capacitance associated with conventional DIP connections. A capacitor may be molded into the DIP across the power supply leads to provide filtering for the package. Thermal dissipation is provided by two separate means in this package. First, the leadframe of the DIP is formed to include relatively long leads which extend through the bottom of the package to carry away the heat generated by the integrated circuit and the DIP itself may be disposed on a thermally conductive substrate which will also dissipate heat generate by the integrated circuit. Second, the metal cover of the package is attached to the optical device by a thermally conductive epoxy to provide a heat path for the optical device. Molded plastic piece parts are utilized to form the optical sleeve and an optical frame assembly.

Claims16

Dependent claims

An optical communication arrangement comprising

a semiconductor optical device;
mounting means for said optical device including a pair of electrical leads extending therefrom;
an optical sleeve comprising a plastic material which is capable of being molded, said optical sleeve including a central bore for insertion of an optical fiber assembly;
a connector frame assembly comprising a plastic material identical in composition to said optical sleeve, said frame assembly including a bore formed through a endwall thereof for insertion of said optical sleeve, said connector frame assembly further comprising an optical fiber connector port, said connector port appropriately shaped by means of molding;
a plastic dual-in-line package for housing an integrated circuit required to operate said semiconductor optical device, said dual-in-line package including a pair of end-prong leads for connection to the pair of electrical leads extending from said mounting means, said dual-in-line package further comprising a plurality of relatively long leads extending from both sides of said package;
a bottom support plate disposed under said dual-in-line package in a manner such that the plurality of relatively long leads pass through a plurality of associated holes formed in said bottom support plate, said leads being utilized for connection to external circuitry;
and
a metallic cover plate disposed to contact said connector frame assembly such that said dual-in-line package and said optical sleeve are fully encased.

5 more elements

Dependencies are inferred from the claim text.

Facts

Application: 07/305,249Filed 1 Feb 1989
Granted: 27 Mar 1990
Term ends: Not estimatedThe source records don’t support an estimate.

Classification9 codes

G02B 6/4292
Coupling light guides with opto-electronic elements: the light guide being disconnectable from the opto-electronic element, e.g. mutually self…
G02B 6/4204
Packages, e.g. shape, construction, internal or external details: the coupling comprising intermediate optical elements, e.g. lenses, holograms
G02B 6/4245
Fixing or mounting methods of the aligned elements: mounting of the opto-electronic elements
G02B 6/4246
Packages, e.g. shape, construction, internal or external details: bidirectionally operating package structures