US 4,910,757 AGranted

Method and apparatus for X-ray imaging

AssigneeHitachi, Ltd.

InventorsSenya Kiyasu, Takanori Ninomiya

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Abstract

Two X-ray transmission images of an object, e.g. an electronic device package structure having plural soldering layers are detected in two directions inclined to the plural layers, on the basis of a relative position relation between both X-ray transmission images, one X-ray transmission image is converted on the assumption that soldering portions to be detected are located at a certain layer, into the image in the direction in which the other X-ray transmission image has been detected, and the converted X-ray transmission image is with the other X-ray transmission image to decide that the soldering portions at coincided positions are located at the layer at issue. Further, an object such as an electronic device package structure having soldering portions is irradiated with plural kinds of X-rays with different photon energy spectra to detect the corresponding X-ray transmission images of the object and the X-ray transmission images are processed referring to a previously prepared numerical value table indicating relations between the transmission distances of the plural kinds of X-rays for the soldering portions of the other substance and the transmission X-ray intensities therefor in order to separately detect an image of the soldering portions.

Claims6

Dependent claims

A method for detecting with an X-ray imaging apparatus a defective portion of a plurality of solder connections of an object connected with said solder connections between an IC device and a multi-layer circuit board comprising the steps of:

exchanging by a filter exchanging means a lead plate filter used to filter a first X-ray having a first photon energy spectra fitted to said solder connections, and a wiring lead metal plate filter used to filter a second X-ray having a second photon energy spectra fitted to a wiring lead formed in the multi-layer circuit board;
irradiating the object with each of said first X-ray and said second X-ray at a predetermined angle perpendicular to a surface of the object, such that an X-ray transmission intensity signal (Ia) of the solder connections and an X-ray transmission intensity image signal (Ib) of the wiring leads are obtained;
etecting each of the X-ray transmission intensity image signals (Ia, Ib) of the object obtained by irradiating each of said first X-ray and said second X-ray to the object so that said intensity image signal (Ia) of the solder portions and said intensity image signal of the wiring lead (Ib) are superposed;
converting each of the X-ray transmission intensity image signals (Ia, I) from analog format to digital format;
storing to selected image memories each of the converted digital X-ray transmission intensity image signals (Ia, Ib);
and
extracting by an image separation processing means a thickness image (T.sub.x) of the solder portions from the superposed images by processing values of said digital intensity image signals (Ia, Ib) for each of a plurality of picture elements (I, J) readout from each of the selected image memories over a predetermined area, the processing being accomplished by referring to a numerical value table indicating relations between transmission X-ray intensity values and values of image thicknesses (Tx) of the solder portions.

4 more elements

An apparatus for detecting a defective portion of a plurality of solder connections of an object which is connected with the solder connections between an IC device and a multi-layer circuit board comprising:

an X-ray source having control means for controlling a tube voltage;
a filter exchanging means for exchanging a lead plate filter used to obtain a first X-ray having a first photon energy spectra fitted to said solder connections, and a wiring lead metal plate filter used to obtain a second X-ray having a second photon energy spectra fitted to a wiring lead formed in the multi-layer circuit board;
irradiating means for irradiating each of said first X-ray and said second X-ray to the object from a predetermined angle perpendicular to a surface of the object, such that an X-ray transmission intensity image signal (Ia) of the solder portions and an X-ray transmission intensity image signal (Ib) of the wiring lead ae obtained;
detecting means for detecting each of the X-ray transmission intensity image signals (Ia, Ib) of the object obtained by irradiating each of said first X-ray and said second X-ray to the object so that said intensity image signal (Ia) of the solder portions and said intensity image signal (Ib) of the wiring lead are superposed;
an A/D converter for converting from said each of the X-ray transmission intensity image signals (Ia, Ib) to digital X-ray transmission intensity image signals corresponding to a plurality of picture elements (I,J);
an image memory for storing each of the digital X-ray transmission intensity image signals obtained from said A/D converter;
a numerical value table indicating relations between the transmission X-ray intensity values and the thickness (Tx) of the solder portions;
and,
an image separation processing means for extracting a value representative of image thickness (Tx) of the solder portions from the superposed images by processing values of said digital intensity image signals (Ia, Ib) for each of the picture elements (I,J) readout from the image memory over a predetermined area by referring to said numerical value table.

6 more elements

Dependencies are inferred from the claim text.