Thick film, multi-layer, ceramic interconnected circuit board

A multi-layer, interconnected circuit board comprising:

• a substrate of an electrical insulating material which will withstand high temperatures;
• a plurality of fired glass dielectric layers stacked over a surface of said substrate;
• a separate thick film conductive layer between each pair of adjacent dielectric layers, each of said conductive layers being a layer of a fired conductive material including glass and particles of a conductive material dispersed therein;
• each of said dielectric layers between a pair of conductive layers having at least one opening therethrough which is filled with a fired conductive material making contact with at least one of the conductive layers, and the topmost dielectric layer having an opening therethrough which is filled with a conductive material making contact with at least one conductive layer;
• a conductive contact pad over the topmost dielectric layer and electrically connected to the conductive material said contact pad being a layer of a fired conductive material including glass and conductive particles dispersed therein;
• and
• a bonding layer between the contact pad and the topmost dielectric layer, said bonding layer being a fired mixture of the glass of the dielectric layers and the conductive material of the contact pad.