Connector and semiconductor device packages employing the same
AssigneeHitachi, Ltd.
InventorsShousaku Ishihara, Hitoshi Yokono, Tsuyoshi Fujita, Ryohei Satoh, Kiyotaka Wasai
Life of this patent
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Abstract
The present invention relates to a connector structure for soldering a wiring substrate such as a ceramic wiring substrate to a connector provided on a printed board and also pertains to semiconductor device packages using the same. It is an object of the present invention to provide a connector structure which provides highly reliable electrical connection, together with semiconductor device package using the same. The object is attained by soldering a ceramic wiring substrate to a connector which involves a heater.
Claims18
A semiconductor device package comprising:
- a printed board;
- a connector having a first side closest to the printed board, the first side having a first surface, the connector being provided on said first surface with pins which are adapted to be inserted into said printed board;
- a wiring substrate soldered to a second side of said connector, the connector having conductive material elements extending therethrough from the first side to the second side, the connector having heater means provided around the conductive material elements extending through the connector;
- a semiconductor integrated circuit element mounted on said wiring substrate;
- and
- a cooling fin for cooling said semiconductor integrated circuit element, said cooling fin being in thermal connection with said semiconductor integrated circuit element.
A semiconductor device package comprising:
- a printed board;
- a connector having a first side closest to the printed board, the first side having a first surface, the connector being provided on said first surface with pads which are adapted to be soldered to said printed board, the connector having a second side with a second surface, and being provided on said second surface with other pads;
- a wiring substrate soldered to said second side of said connector, the connector having conductive material elements extending therethrough from the first side to the second side, the connector having heater means provided around the conductive material elements extending through the connector;
- a semiconductor integrated circuit element mounted on said wiring substrate;
- and
- a cooling fin for cooling said semiconductor integrated circuit element, said cooling fin being in thermal connection with said semiconductor integrated circuit element.
Dependencies are inferred from the claim text.