Circuit module for multi-pin connector

A metal oxide varistor for use in the body of a multi-pin connector or a circuit module attached to a multi-pin connector, comprising:

• a zinc oxide wafer with at least one aperture therein for receiving a connector pin;
• a metallized ground plane encompassing the edges and one side of said zinc oxide wafer, the metallized ground plane along the side having apertures therein overlaying and greater in diameter than the aperture in the zinc oxide layer;
• a metallized pad for each aperture on the other side of the zinc wafer overlaying the apertures in the zinc layer and having an aperture therein of equal size;
• and
• an insulating coating overlaying the ground plane and filling in the space between the aperture in the zinc oxide and the aperture in the ground plane.

A metal oxide varistor for use in the body of a multi-pin connector or a circuit module attachable to the pins of a multi-pin connector, comprising:

• a zinc oxide wafer configured to fit within said body or said circuit module and having apertures therein aligned with the pins of said multi-pin connector to accept insertion of at least one connector pin;
• at least one connector pin inserted through an aperture in the zinc oxide wafer;
• a metallized pad surrounding and contacting the base of each connector pin and contacting the metal oxide wafer where it enters the aperture in the metal oxide wafer;
• a grounded metallized layer attached to the edges of the zinc oxide wafer and to the other side of the wafer, said layer having aperture therein that are larger in diameter than and overlaying the apertures in the zinc oxide wafer;
• and
• an insulative coating enshrouding the entire exterior of the varistor and filling in the spaces between the apertures in the zinc oxide layer and the apertures in the ground plane.