Thermosetting resin composition

Abstract

A thermosetting resin composition is prepared by mixing (A) a phenol novolak resin having hydroxy groups and allyl-etherified hydroxy groups, (B) a polymaleimide compound having two or more maleimide groups in the molecule, and (C) at least one silicone resin having the following formula (I); ##STR1## wherein R.sub.1 and R.sub.2, which may be the same or different, are methyl or phenyl; R.sub.3 and R.sub.4, which may be the same or different, are methyl, phenyl, hydrogen or a group having an amino group or an epoxy group but at least one of R.sub.3 and R.sub.4 is hydrogen or a group having an amino group or an epoxy group; and l and m, which may be the same or different, are a number of 0-400. The thermosetting resin composition of the present invention can be suitably used for encapsulating electric devices, for example, and gives, by curing, a cured resin product of high quality.

Dependencies are inferred from the claim text.