Foil for soldering the terminals of an electronic component
AssigneeVDO Adolf Schindling AG
InventorFrank Treffer
Life of this patent
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Abstract
A foil (15) has cutouts (17) which are bridged over by strips of solder (18, 19). The cutouts (17) are so dimensioned that the strips of solder (18, 19) can be placed transversely over the ends of conductive paths (9-14). The terminals (3-8) of the corresponding electronic component (2) are then placed on the strips of solder (18, 19). Pressure is exerted by means of a ram and heat applied, which leads to the melting of the strips of solder (18, 19) and thus to the soldering of the terminals (3-8) to the conductive paths (9-14).
Claims5
A foil with strips of solder disposed on the soil, the strips of solder being positioned for soldering terminals of electronic components to conductive paths on a board which supports the electronic components, the foil being formed with cutouts, the cutouts being bridged over by the strips of solder;
- and wherein
- the cutouts are configured to expose a plurality of the conductive paths to the strips of solder upon an emplacement of the foil upon the board with the cutouts in registration with said terminals.
Dependencies are inferred from the claim text.