Low-cost semiconductor device package process
AssigneeNational Semiconductor Corporation
InventorsGary B. Goodrich, Jadish G. Belani
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Abstract
An adhesive composition for attaching semiconductor die to a substate of a semiconductor device package includes a crosslinkable resinous polyimide, and an aminosilane cross-linking agent. For applications where backside contact to the semiconductor die is desired, the composition also contains finely divided conductive metal, such as silver flakes. When used in a novel process in which the adhesive composition is placed on the semiconductor device substrate prior to gelling, outgassed, a semiconductor die is placed on the outgassed composition, and the composition cured, the resulting semiconductor device package meets military specifications with a substantial cost reduction.
Claims3
A process for encapsulating a semiconductor die, which comprises:
- adding an alkylaminotrialkoxysilane crosslinking agent to a crosslinkable resinous polyimide precursor which will cure to give a polyimide having a recurring unit of the formula:
- ##STR2## in which R.sub.1 and R.sub.2 are radicals of a tetravalent aromatic group and a divalent aromatic group, respectively, and n is a positive integer,
- degassing the resulting composition,
- applying the degassed composition to a substrate prior to gelling of the composition,
- positioning the semiconductor die on the substrate,
- curing the degassed composition to attach the semiconductor die to the substrate,
- applying an enclosure over the semiconductor die on the substrate, and
- hermetically sealing the attached semiconductor die by bonding the enclosure to the substrate over the semiconductor die through application of heat at a temperature of at least about 450.degree. C.
Dependencies are inferred from the claim text.