Gallium arsenide on sapphire heterostructure
AssigneeKYOCERA Corporation
InventorsTakashi Hosoi, Kokichi Ishibitsu
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AssigneeKYOCERA Corporation
InventorsTakashi Hosoi, Kokichi Ishibitsu
Estimating the term…
Disclosed is a process for the production of a semiconductor element by introducing a gas of an organic metal compound of an element of the group III and a gas containing an element of the group V into a reaction chamber in which a substrate of a single crystal of alumina is arranged and epitaxially growing a III.V compound semiconductor by the thermal decomposition vapor deposition of the compound of the elements of the groups III.V, said process comprises, in combination, the steps of (A) heating the substrate at a temperature of 400.degree. to 550.degree. C., introducing the gas of the organic metal compound of the element of the group III and the gas containing the element of the group V into the reaction chamber and forming a film of a compound of the elements of the groups III.V on the surface of the substrate by the vapor deposition, (B) heating the substrate obtained at the step (A) at a temperature higher than 550.degree. C. but lower than 750.degree. C. and introducing the gas containing the element of the group V to anneal the film of the compound of the elements of the groups III.V, and (C) maintaining the substrate obtained at the step (B) at a temperature higher than 550.degree. C. but lower than 750.degree. C. and introducing the gas of the organic metal compound of the element of the group III and the gas containing the element of the group V to effect the vapor deposition of a compound semiconductor of the elements of the groups III.V with the film of the III.V compound film obtained at the step (B) being as the nucleus.
A semiconductor element comprising a single crystal sapphire substrate and a film of a gallium-arsenic semiconductor formed on the substrate by the epitaxial growth, wherein the off angle to the epitaxial growth plane from the plane (0001) of the crystal of the sapphire substrate is greater or equal to 0.5.degree. but smaller than 5.degree., the film of the gallium-arsenic semiconductor has a thickness of at least 1 .mu.m and the surface of the film of the gallium-arsenic semiconductor has such a smoothness that the maximum height roughness is smaller than 0.1 .mu.m (smaller than 0.1 S).
A semiconductor element comprising a single crystal sapphire substrate, a first semiconductor film of an annealed compound of elements of the groups III.V formed on the substrate by epitaxial growth and a second semiconductor film of a compound of elements of the groups III.V formed on the first semiconductor film by epitaxial growth.
Dependencies are inferred from the claim text.