Chip to multilevel circuit board bonding

The process for bonding an integrated circuit chip to a multi-level circuit board comprising:

• forming conductive patterns along a horizontal surface of a plurality of circuit boards said conductive patterns having conductive termination regions disposed along vertical edge portions of the circuit boards for communicating signals to and from the circuit board conductive patterns;
• stacking the circuit boards such that the termination regions are in substantial vertical alignment;
• connecting the aligned conductive termination regions by conductive vertical vias, said vias extending along vertical edge portions of the well defined by stacked circuit boards;
• connecting a plurality of conductive strips to terminals of an integrated circuit;
• disposing the integrated circuit adjacent the stacked circuit boards such that the conductive strips effect electrical communication between the integrated circuit and the conductive patterns formed on the circuit boards.

A process for bonding an integrated circuit to conductive patterns formed on a multilevel circuit board comprising:

• drilling a plurality of apertures in each of a plurality of circuit boards;
• forming conductive termination regions about each of the apertures and a conductive coating on the aperture walls;
• connecting the termination regions to a circuit pattern formed on at least one surface of each of the circuit boards;
• cutting each of the circuit boards such that the conductive termination regions are disposed adjacent vertical edge portions of the circuit boards;
• stacking the layers such that the conductive termination regions are in substantial vertical alignment;
• forming a conductive path connecting the termination regions formed on the aligned edge portions, said conductive path being exposed along the aligned vertical edge portions of the circuit boards;
• connecting flexible conductive strips to terminals of the integrated circuit, each of said strips being connected to a dedicated terminal;
• disposing the integrated circuit adjacent to the aligned vertical edge portions such that the flexible conductive strips extend to abutting electrical connection with the conductive vertical paths to effect electrical communication between the integrated circuit terminals and the conductive patterns formed on the circuit boards.

A multilayer integrated circuit module comprising:

• a first circuit board layer forming a module base;
• a plurality of second circuit board layer stacked upon said base, each of said second board layers having an electrical conductive pattern formed on a horizontal surface thereof, each of said second circuit board layers being formed to have a cut-out region which, upon stacking of said second circuit board layers collectively form a well above the base;
• each of said conductive patterns formed on said second circuit board layers includes a conductive termination region exposed to the cut-out region;
• an integrated circuit having a plurality of terminals mounted on the module base;
• a plurality of conductive vertical vias formed along edge portions of the plurality of second layers, said conductive vias being in electrical communication with the terminal regions formed on a plurality of said second circuit board layers;
• a plurality of flexible conductive strips secured to the integrated circuit terminals and extending from the integrated circuit into abutting electrical connection with the conductive vertical vias.