Circuit module including a plate-shaped circuit carrier of glass or ceramic

A circuit module comprising:

• a plate-shaped circuit carrier;
• a metal plate connected over a large area of one side of said circuit carrier;
• said metal plate having a three-layer structure including two outer layers each consisting of metal of a good thermal conductivity and a center layer sandwiched therebetween consisting of a material having a lesser thermal conductivity than the thermal conductivity of the two outer layers, one of said outer layers spaced from said circuit carrier and having a recess, the other of said outer layers located proximate said circuit carrier;
• said two outer layers having substantially the same thickness and the coefficients of thermal expansion of the outer layers and inner layer being matched such that the resultant coefficient of the metal plate substantially corresponds to the coefficient of thermal expansion of the circuit carrier;
• said metal plate having openings in the center layer;
• said two outer layers being integrally joined to one another through said openings in said center layer;
• and
• a thermally-high-stressed component located in said recess in said one of said outer layers spaced from said circuit carrier, said recess disposed substantially in registry with one of said openings in said center layer.