Encapsulated thermoelectric heat pump and method of manufacture

A thermoelectric heat pump suitable for applications involving stresses above 2,000 g's comprising:

• a plurality of spaced n-type and p-type conductivity thermoelectric elements arranged in an alternatively relationship, the thermoelectric elements having first and second opposing ends;
• first and second insulating substrates having first and second metalizations of conductive material formed thereon, the first and second metalizations having preselected patterns for selectively connecting corresponding first and second ends of the thermoelectric elements to form a serially connected array of thermoelectric elements for a thermoelectric heat pump;
• means connecting the first and second opposing ends of the thermoelectric elements to the corresponding first and second metalizations of the first and second substrates;
• first and second leads connected, respectively, to the first n-type and last p-type thermoelectric elements of the serially connected array of thermoelectric elements for connection to a source or power;
• and
• encapsulation material filling the spaces between the plurality of spaced n-type and p-type conductivity thermoelectric elements for strengthening the thermoelectric heat pump to withstand gravitational forces above about 2,000 g's said encapsulation material including a plastic material substantially filled with hollow particles having a size in the range of about 30 to 180 microns and a wall thickness of about 1.5 microns for reducing substantially the specific gravity and increasing substantially the strength of the encapsulating material.