Semiconductor device
AssigneeNEC Corporation
InventorShinichi Chikaki
Life of this patent
Estimating the term…
Abstract
A semiconductor device in which a polyimide film is used as an inter-ply insulating film is disclosed. Bonding pads are formed on the polyimide film and an insulating film such as a silicon nitride film is formed on the polyimide film and on the bonding pads except bonding areas thereof. At least one small aperture is formed in the insulating film and a metal layer having an island shape is provided on the polyimide film within the small aperture.
Claims13
A semiconductor device comprising a semiconductor substrate, a polyimide film formed on said substrate, bonding pads provided on said polyimide film, a first metal layer provided on said polyimide film and having an island shape, said first metal layer being a completely electrically insulated layer, an insulating film having better moisture proof characteristics than said polyimide film and formed on said polyimide film to cover said bonding pads and said first metal layer, openings formed in said insulating film to expose bonding areas of said bonding pads, respectively, and a first aperture having a smaller area than each said opening and formed in said insulating film on said first metal layer to expose a surface section of said first metal layer.
Dependencies are inferred from the claim text.