Electrical circuit interconnect system

An interconnection assembly for providing a connection between a microstrip circuit and a coaxial cable, the microstrip circuit comprising at least one conductor on a first surface of an insulating substrate and a ground plane located on a second surface of said insulating substrate, opposite said first surface, said conductor terminating adjacent on outer edge of said substrate, the assembly comprising:

• a. a conductive lip located around at least a portion of the outer edge of said insulating substrate, said conductive lip extending from said ground plane and having a cut adjacent to the first surface of said substrate where said conductor terminates, said substrate having a groove aligned with said cut;
• and
• b. a coaxial feed through connector comprising a cylindrical section and a transmission pin extending axially through the cylindrical section, said cylindrical section being mounted in said groove, said transmission pin being electrically secured to said adjacent conductor.

An interconnection assembly for providing a cover for a microstrip circuit said microstrip circuit comprising at least one conductor on a first surface of an insulating substrate and a ground plane located on a second surface of said insulating substrate opposite said first surface, the assembly comprising:

• a. a conductive frame located around at least a portion of the outer perimeter of said substrate surface supporting said conductor, said conductive frame comprising plating integral with said ground plane;
• and
• b. a cover formed of electrically conductive material over said substrate surface, said substrate surface supporting said cover, said cover including a lip extending around the outer perimeter of said cover, said lip being in contact with said conductive frame.

An assembly for electrically isolating at least one component mounted on an electrical circuit, said circuit comprising at least one conductor on a first surface of an insulating substrate and a ground plane over a second surface of said substrate opposite said first surface, the assembly comprising:

• a. an enclosure composed of conductive material mounted on said first surface of said insulating substrate so as to house and electrically isolate the component, said enclosure forming at least one pass-through bore adjacent to said insulating substrate, said conductor electrically connected to said component through said pass-through bore;
• and
• b. at least one conductive path from said enclosure extending to said ground plane through said insulating substrate.