Broadband microstrip to coplanar waveguide transition by anisotropic etching of gallium arsenide

A broadband interconnection device used for interconnection between a microstrip and a coplanar waveguide, comprising:

• a monolithic semiconductor wafer having a coplanar waveguide defined at a first edge on an upper surface, said coplanar waveguide including a conductor and a pair of ground planes, a conductor of a microstrip defined on an opposite edge of said top surface, and a ground plane of said microstrip on a bottom surface, said conductor of said coplanar waveguide being electrically connected to said conductor of said microstrip;
• a pair of sloped surfaces in said monolithic semiconductor wafer, said surfaces sloping from said pair of ground planes of said coplanar waveguide on said upper surface to said ground plane of said microstrip on said bottom surface, said pair of sloped surfaces being metalized with high conductivity metal, said high conductivity metal being in contact with said ground plane of said microstrip and said ground planes of said coplanar waveguide.