Output buffer for improving di/dt
AssigneeMotorola, Inc.
InventorsSamuel E. Alexander, Alan R. Bormann
Life of this patent
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AssigneeMotorola, Inc.
InventorsSamuel E. Alexander, Alan R. Bormann
Estimating the term…
An integrated circuit comprises a chip containing electric circuits in a package with leads. The chip receives power via the leads. The leads have inductance so that when there is a change in current flow (di/dt) through a lead there is a voltage which is developed between the end of the lead and the chip which can cause the chip to either malfunction or function poorly. The highest di/dt is generally caused by an output buffer that changes the logic state of its output. The typical output buffer has a pair of driver transistors that provide one of a logic high or logic low. The di/dt generated by these transistors is controlled by controlling the voltage on the gate or base of the transistor which is providing the particular logic state. This control is responsive to the magnitude of the power supply voltage. An impedance which varies in resistance with supply voltage is placed in series between the positive power supply terminal and the gate or base of the output transistors.
A buffer circuit, comprising:
A buffer circuit comprising:
A buffer circuit, comprising:
A buffer circuit, comprising:
In an integrated circuit comprising a chip containing electrical circuits contained in a package having leads, wherein a first lead is connected to a first power supply terminal of the chip, a second lead is connected to a second power supply terminal of the chip, and a third lead is connected to an output terminal of the chip, the first and second leads characterized as having inductance, a buffer circuit in the chip, comprising:
Dependencies are inferred from the claim text.