US 4,906,802 A · Molded chip carrier

Abstract

A molded chip carrier includes an integral carrier body made from a first molded section having a predetermined shape and a second molded section having a second predetermined shape. One of the first and second molded sections is made from a non-conductive material and the other section is made from a non-conductive material that is capable of receiving a deposit of conductive material. A conductive material is deposited on the outer exposed surface of the molded section capable of receiving the deposit. This particular molded section has an outer surface that defines a plurality of non-intersecting, continuous paths that form the input/output leads on the carrier body. The chip carrier includes a protective cap that can be placed over an electronic chip mounted within the carrier body.

Claims38

Dependent claims

A chip carrier having a central portion for receiving an electronic component in chip form, comprising:

a first molded section having a first predetermined shape;
a second molded section having a second predetermined shape;
said first and second molded sections forming an integral carrier body which includes a generally peripheral wall that defines an integrally molded protective cavity, said peripheral wall having an exterior surface, a top surface, and an inward-facing surface, and protected within the integrally molded cavity a mounting site for such electronic component;
wherein each of said first and said second molded sections has an exposed surface;
but one of said molded sections is relatively much more susceptible to receiving a deposit of conductive material on its exposed surface, and the other of said molded sections is relatively much more resistant to receiving such a deposit on its exposed surface;
a conductive material deposit, on the exposed surface that is relatively more susceptible to receiving a deposit of conductive material, and defining electrical leads that extend, continuously along said exterior, top, and inward-facing surfaces of said generally peripheral wall, into said integrally molded protective cavity;
whereby electrical connections between the electrical leads and a component installed on the mounting site can be made entirely within and protected by the integrally molded cavity of the integral carrier body.

4 more elements

A chip carrier having a central portion for receiving an electronic component in chip form, comprising:

a first molded section having a first predetermined shape;
a second molded section having a second predetermined shape;
said first and second molded sections forming an integral carrier body which includes an integrally molded protective cavity, and protected within the integrally molded cavity a mounting site for such electronic component;
wherein each of said first and said second molded sections has an exposed surface;
but one of said molded sections is relatively much more susceptible to receiving a deposit of conductive material on its exposed surface, and the other of said molded sections is relatively much more resistant to receiving such a deposit on its exposed surface;
a conductive material deposit, on the surface that is relatively more susceptible to receiving a deposit of conductive material, and defining electrical leads that extend into said integrally molded protective cavity;
whereby electrical connections between the electrical leads and a component installed on the mounting site can be made entirely within and protected by the integrally molded cavity of the integral carrier body;
wherein the integral carrier body further comprises at least one side portion that has a top;
and
wherein at least along part of the top of the side portion, the electrical leads are defined along surfaces that are recessed by distances substantially equal to the respective thicknesses of the leads;
whereby the leads are flush with the top of the side portion, along at least a part of the top of the side portion.

8 more elements

A chip carrier having a central portion for receiving an electronic component in chip form, comprising:

a first molded section having a first predetermined shape;
a second molded section having a second predetermined shape;
said first and second molded sections forming an integral carrier body which includes an integrally molded protective cavity, and protected within the integrally molded cavity a mounting site for such electronic component;
wherein each of said first and said second molded sections has an exposed surface;
but one of said molded sections is relatively much more susceptible to receiving a deposit of conductive material on its exposed surface, and the other of said molded sections is relatively much more resistant to receiving such a deposit on its exposed surface;
a conductive material deposit, on the surface that is relatively more susceptible to receiving a deposit of conductive material, and defining electrical leads that extend into said integrally molded protective cavity;
whereby electrical connections between the electrical leads and a component installed on the mounting site can be made entirely within and protected by the integrally molded cavity of the integral carrier body;
wherein said second molded section is made from a nonconductive material that is more resistant to receiving a conductive deposit;
wherein said first molded section is made from a nonconductive material that is more susceptible to receiving a conductive deposit, said second molded section being molded about said first molded section;
wherein said integral carrier body includes a top portion, a bottom portion and at least one side portion, said first portion having a plurality of nonoverlapping, continuous paths formed thereon that extend from said top portion along said side portions to said bottom portion;
and
wherein said top portion has a continuous channel extending therein;
and
further including a protective cap having a projecting ridge extending therefrom, said projecting ridge being receivable in said channel.

11 more elements

A chip carrier having a central portion for receiving an electronic component in chip form, comprising:

a first molded section having a first predetermined shape;
a second molded section having a second predetermined shape;
said first and second molded sections forming an integral carrier body which includes an integrally molded protective cavity, and protected within the integrally molded cavity a mounting site for such electronic component;
wherein each of said first and said second molded sections has an exposed outer surface;
but one of said molded sections is relatively much more susceptible to receiving a deposit of conductive material on its exposed outer surface, and the other of said molded sections is relatively much more resistant to receiving such a deposit on its exposed outer surface;
a conductive material deposit, on the outer surface that is relatively more susceptible to receiving a deposit of conductive material, and defining electrical leads that extend into said integrally molded protective cavity;
whereby electrical connection between the electrical leads and a component installed on the mounting site can be made entirely within and protected by the integrally molded cavity of the integral carrier body;
wherein the electrical leads extend into said integrally molded cavity to inner ends that are immediately adjacent to said mounting site;
whereby such electrical connections between the inner ends of the leads and a component installed on the mounting site need span only a very short gap that is well within and entirely protected by the integrally molded cavity;
wherein the integral carrier body further comprises at least one side portion that has a top;
and
wherein the electrical leads slope radially outward and upward from within the cavity to the top of the side portion, and extend radially outward along the top of the side portion;
and
wherein at least along part of the top of the side portion, the electrical leads are defined along surfaces that are recessed by distances substantially equal to the respective thicknesses of the leads;
whereby the leads are flush with the top of the side portion, along at least a part of the top of the side portion.

12 more elements

A method for producing and using a chip carrier comprising the steps of:

molding a first section into a first predetermined shape;
molding a second section with a second predetermined shape;
in one of the two molding steps, creating first molded surfaces which after setting are relatively susceptible to receiving a deposit of conductive material;
and, in the other of the two molding steps, creating second molded surfaces which after setting are relatively resistant to receiving a deposit of conductive material;
forming an integral carrier body when said first and said second sections are combined, said integral carrier body having a peripheral wall, and having exposed areas comprising portions of said first section and portions of said second section;
said forming step comprising:
forming an exterior surface of the peripheral wall,
forming a top surface of the peripheral wall, and
forming an inward-facing surface of the peripheral wall;
depositing a conductive material to define electrical leads on the first molded surfaces but not the second molded surfaces;
said depositing step comprising:
depositing conductive material to define leads that extend continuously along said exterior surface of the wall,
depositing conductive material to define leads that extend continuously along said top surface of the wall, and that are respectively continuous with said leads that extend along said exterior surface of said wall,
depositing conductive material to define leads that extend continuously along said inward-facing surface, and that are respectively continuous with said leads that extend along said top surface;
installing an integrated-circuit chip in the carrier, with connection points of the chip electrically interconnected with said conductive material on respective first molded surfaces;
and
securing the carrier to a circuit board and electrically interconnecting said conductive material on the first molded surfaces with respective elements of a conductive footprint on said circuit board.

14 more elements

Dependencies are inferred from the claim text.

Facts

Application

07/157,927Filed 18 Feb 1988

Granted

6 Mar 1990

Term ends

Not estimatedThe source records don’t support an estimate.

Classification8 codes

H10W 70/657
Shapes or dispositions of interconnections: on sidewalls or bottom surfaces of the package substrates, interposers or redistribution layers
H05K 3/182
By electroless plating: characterised by the patterning method
H05K 3/403
Forming printed elements for providing electric connections to or between printed circuits: edge contacts; Windows or holes in the substrate…
H10W 72/5522
Comprising metals or metalloids, e.g. silver: comprising gold [Au]

Abstract

Claims38

Dependent claims

A chip carrier having a central portion for receiving an electronic component in chip form, comprising:

a first molded section having a first predetermined shape;
a second molded section having a second predetermined shape;
said first and second molded sections forming an integral carrier body which includes a generally peripheral wall that defines an integrally molded protective cavity, said peripheral wall having an exterior surface, a top surface, and an inward-facing surface, and protected within the integrally molded cavity a mounting site for such electronic component;
wherein each of said first and said second molded sections has an exposed surface;
but one of said molded sections is relatively much more susceptible to receiving a deposit of conductive material on its exposed surface, and the other of said molded sections is relatively much more resistant to receiving such a deposit on its exposed surface;
a conductive material deposit, on the exposed surface that is relatively more susceptible to receiving a deposit of conductive material, and defining electrical leads that extend, continuously along said exterior, top, and inward-facing surfaces of said generally peripheral wall, into said integrally molded protective cavity;
whereby electrical connections between the electrical leads and a component installed on the mounting site can be made entirely within and protected by the integrally molded cavity of the integral carrier body.

4 more elements

A chip carrier having a central portion for receiving an electronic component in chip form, comprising:

a first molded section having a first predetermined shape;
a second molded section having a second predetermined shape;
said first and second molded sections forming an integral carrier body which includes an integrally molded protective cavity, and protected within the integrally molded cavity a mounting site for such electronic component;
wherein each of said first and said second molded sections has an exposed surface;
but one of said molded sections is relatively much more susceptible to receiving a deposit of conductive material on its exposed surface, and the other of said molded sections is relatively much more resistant to receiving such a deposit on its exposed surface;
a conductive material deposit, on the surface that is relatively more susceptible to receiving a deposit of conductive material, and defining electrical leads that extend into said integrally molded protective cavity;
whereby electrical connections between the electrical leads and a component installed on the mounting site can be made entirely within and protected by the integrally molded cavity of the integral carrier body;
wherein the integral carrier body further comprises at least one side portion that has a top;
and
wherein at least along part of the top of the side portion, the electrical leads are defined along surfaces that are recessed by distances substantially equal to the respective thicknesses of the leads;
whereby the leads are flush with the top of the side portion, along at least a part of the top of the side portion.

8 more elements

A chip carrier having a central portion for receiving an electronic component in chip form, comprising:

a first molded section having a first predetermined shape;
a second molded section having a second predetermined shape;
said first and second molded sections forming an integral carrier body which includes an integrally molded protective cavity, and protected within the integrally molded cavity a mounting site for such electronic component;
wherein each of said first and said second molded sections has an exposed surface;
but one of said molded sections is relatively much more susceptible to receiving a deposit of conductive material on its exposed surface, and the other of said molded sections is relatively much more resistant to receiving such a deposit on its exposed surface;
a conductive material deposit, on the surface that is relatively more susceptible to receiving a deposit of conductive material, and defining electrical leads that extend into said integrally molded protective cavity;
whereby electrical connections between the electrical leads and a component installed on the mounting site can be made entirely within and protected by the integrally molded cavity of the integral carrier body;
wherein said second molded section is made from a nonconductive material that is more resistant to receiving a conductive deposit;
wherein said first molded section is made from a nonconductive material that is more susceptible to receiving a conductive deposit, said second molded section being molded about said first molded section;
wherein said integral carrier body includes a top portion, a bottom portion and at least one side portion, said first portion having a plurality of nonoverlapping, continuous paths formed thereon that extend from said top portion along said side portions to said bottom portion;
and
wherein said top portion has a continuous channel extending therein;
and
further including a protective cap having a projecting ridge extending therefrom, said projecting ridge being receivable in said channel.

11 more elements

A chip carrier having a central portion for receiving an electronic component in chip form, comprising:

a first molded section having a first predetermined shape;
a second molded section having a second predetermined shape;
said first and second molded sections forming an integral carrier body which includes an integrally molded protective cavity, and protected within the integrally molded cavity a mounting site for such electronic component;
wherein each of said first and said second molded sections has an exposed outer surface;
but one of said molded sections is relatively much more susceptible to receiving a deposit of conductive material on its exposed outer surface, and the other of said molded sections is relatively much more resistant to receiving such a deposit on its exposed outer surface;
a conductive material deposit, on the outer surface that is relatively more susceptible to receiving a deposit of conductive material, and defining electrical leads that extend into said integrally molded protective cavity;
whereby electrical connection between the electrical leads and a component installed on the mounting site can be made entirely within and protected by the integrally molded cavity of the integral carrier body;
wherein the electrical leads extend into said integrally molded cavity to inner ends that are immediately adjacent to said mounting site;
whereby such electrical connections between the inner ends of the leads and a component installed on the mounting site need span only a very short gap that is well within and entirely protected by the integrally molded cavity;
wherein the integral carrier body further comprises at least one side portion that has a top;
and
wherein the electrical leads slope radially outward and upward from within the cavity to the top of the side portion, and extend radially outward along the top of the side portion;
and
wherein at least along part of the top of the side portion, the electrical leads are defined along surfaces that are recessed by distances substantially equal to the respective thicknesses of the leads;
whereby the leads are flush with the top of the side portion, along at least a part of the top of the side portion.

12 more elements

A method for producing and using a chip carrier comprising the steps of:

molding a first section into a first predetermined shape;
molding a second section with a second predetermined shape;
in one of the two molding steps, creating first molded surfaces which after setting are relatively susceptible to receiving a deposit of conductive material;
and, in the other of the two molding steps, creating second molded surfaces which after setting are relatively resistant to receiving a deposit of conductive material;
forming an integral carrier body when said first and said second sections are combined, said integral carrier body having a peripheral wall, and having exposed areas comprising portions of said first section and portions of said second section;
said forming step comprising:
forming an exterior surface of the peripheral wall,
forming a top surface of the peripheral wall, and
forming an inward-facing surface of the peripheral wall;
depositing a conductive material to define electrical leads on the first molded surfaces but not the second molded surfaces;
said depositing step comprising:
depositing conductive material to define leads that extend continuously along said exterior surface of the wall,
depositing conductive material to define leads that extend continuously along said top surface of the wall, and that are respectively continuous with said leads that extend along said exterior surface of said wall,
depositing conductive material to define leads that extend continuously along said inward-facing surface, and that are respectively continuous with said leads that extend along said top surface;
installing an integrated-circuit chip in the carrier, with connection points of the chip electrically interconnected with said conductive material on respective first molded surfaces;
and
securing the carrier to a circuit board and electrically interconnecting said conductive material on the first molded surfaces with respective elements of a conductive footprint on said circuit board.

14 more elements

Dependencies are inferred from the claim text.

Molded chip carrier

Life of this patent

Abstract

Claims38

Molded chip carrier

Life of this patent

Abstract

Claims38