Low viscosity epoxy resin compositions
AssigneeGeneral Electric Company
InventorMark Markovitz
Life of this patent
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Abstract
The viscosities of solventless compositions of epoxy resins containing 1,2 epoxy groups and having at least two epoxide groups per molecule and effective amounts of hardener are markedly reduced whereby they are useful for vacuum-pressure impregnation, pre-impregnation electrical insulating material and structural composite applications by addition of a reactive diluent comprising an aromatic vinyl monomer.
Claims9
A thermosetting resin composition having superior thermal stability consisting essentially of between about 50% and about 95% by weight of 1,2 epoxy resin having at least two epoxide groups per molecule, between about 3% and 33% by weight of a reactive diluent selected from an aromatic vinyl monomer, and between about 1 and 10 parts by weight (pbw) per 100 pbw of the epoxy resin and the reactive diluent of a nitrogen containing organic catalyst hardener selected from the group consisting of an imidazole compound.
A thermosetting resin composition having superior thermal stability consisting essentially of between about 50% and about 95% by weight of 1,2 epoxy resin having at least two epoxide groups per molecule, between about 3% and about 33% by weight of a reactive diluent selected from an aromatic vinyl monomer, and between about 1 and about 10 pbw per 100 pbw of the epoxy resin and the reactive diluent of an imidazole compound catalyst hardener.
Dependencies are inferred from the claim text.