Molded article of thermoplastic resin and process for producing the same
AssigneeNitto Boseki Co., Ltd.
InventorHirokazu Inoguchi
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Abstract
There are disclosed (1) an injection-molded thermoplastic resin article having on a surface thereof a copper foil or a copper foil circuit, wherein the thermoplastic resin comprises one of polycarbonate, polyethersulfone, and polyetherimide and an adhesive layer comprising polyvinyl butyral having a degree of polymerization of up to 1000, polyvinyl formal having a degree of polymerization of up to 1000, or a mixture or both polymers is formed either the copper foil or the copper foil circuit and the molded thermoplastic resin and (2) a process for producing such injection-molded thermoplastic resin articles.
Claims5
An injection-molded resin article which comprises:
- (1) an injection-molded thermoplastic resin comprising at least one thermoplastic resin selected from the group consisting of a polycarbonate, a polyethersulfone and a polyetherimide, and said injection-molded thermoplastic resin having a molded shape;
- (2) a copper foil;
- and
- (3) an adhesive layer composed of the one selected from the group consisting of polyvinyl butyral having a degree of polymerization of up to 1000, a polyvinyl formal having a degree of polymerization of up to 1000 and a mixture of said polyvinyl butyral and said polyvinyl formal;
- said layer being disposed between said injection-molded thermoplastic resin and said copper foil in an amount of at least 20 g/m.sup.2.
Dependencies are inferred from the claim text.