Metallized substrate for electronic device
AssigneeCorning Incorporated
InventorsGaylord L. Francis, Francis W. Martin
Life of this patent
Estimating the term…
Abstract
Metallizing pastes, for forming thick film circuitry on low expansion substrates in electronic devices, are disclosed. The paste contains a glass powder that crystallizes on firing to a glass-ceramic in which lead titanate is the primary crystal phase.
Claims16
An electrical component comprising a ceramic substrate, the ceramic being selected from the group composed of a modified cordierite composition glass-ceramic and aluminum nitride, and thick film circuitry on the substrate surface, the film being composed essentially of 82-98.5% of an electroconductive metal dispersed as a powder in a glass-ceramic matrix, the matrix containing lead titanate as its primary crystal phase whereby the coefficient of thermal expansion of the circuitry matches that of the substrate.
A metallizing paste composed of 82-98.5% of an electroconductive metal powder selected from the group composed of copper, a Pd-Ag mixture, and a noble metal mixed with 18-1.5% of a glass powder having a composition selected from the group composed of a lead-zinc-titanium-borosilicate family and a lead-barium-titanium-borosilicate family, the glass powder being capable of being thermally crystallized in situ to provide a lead titanate primary crystal phase, the mixed powders being blended into a temporary organic vehicle.
Dependencies are inferred from the claim text.