Dry-etching apparatus
AssigneeMatsushita Electric Industrial Co., Ltd.
InventorsKazuyuki Tomita, Masuo Tanno, Yasuo Tanaka
Life of this patent
Estimating the term…
Abstract
The magnetron dry-etching apparatus has, behind its anode electrode (1) facing an object to be etched positioned on a cathode electrode (2), a rotatable magnet assembly comprising at least one pair of rotatable permanent magnets (12) of narrow-pie-shape, fixed on a common yoke (14) so that different polarity magnetic poles (N and S) are disposed side by side; whereby a uniform magnetic field is formed on a wafer (8) on the cathode (2) upon rotation of said magnet assembly, thereby assuring uniform etching even upon change of gas pressure of other etching conditions.
Claims1
A dry-etching apparatus comprising;
- an etching chamber containing a cathode electrode for placing a workpiece substrate thereon,
- an anode electrode installed in parallel arrangement to said cathode electrode with a gap inbetween,
- means for applying R. F. power across said cathode electrode and said anode electrode,
- means for supplying reaction gas to said etching chamber, and
- means for evacuating said etching chamber to predetermined pressure,
- a rotary permanent magnet assembly located behind said anode electrode and having means for rotation in a plane parallel to said anode electrode and comprising a plurality of pairs of narrow-pie-shaped permanent magnets fixed to a yoke in a manner such that different polarity magnetic poles are disposed side by side on both sides of a radial line originating from the center of said rotation, with the apexes of said narrow-pie-shaped permanent magnets at the center, a plurality of pairs of said narrow-pie-shaped permanent magnets being arranged in a manner such that the same polarity magnetic poles of adjacent pairs are disposed side by side on said yoke.
Dependencies are inferred from the claim text.