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US 4,906,346 AGranted
Electroplating apparatus for producing humps on chip components
AssigneeSiemens Aktiengesellschaft
InventorsHans Hadersbeck, Ernst Andrascek
Life of this patent
Estimating the term…
Abstract
The present invention provides an improved electroplating apparatus having an electroplating cell equipped with an anode, cathode and diaphragm ring. The electroplating cell is suspended in an electrolytic bath. The cell is composed of a plastic tube whose lower opening is covered by an anode surface and whose upper opening is covered by a wafer holder for holding the semiconductor wafer. The electroplating apparatus further includes an activated carbon filtering aimed at the levelling effect.
Claims9
An apparatus for electroplating a semiconductor wafer comprising:
- a vessel adapted to contain an electrolytic bath;
- an electroplating cell disposed in said vessel and having an anode forming a bottom of said cell and adapted to permit flow of said electrolytic bath therethrough, said cell having an opening in a top thereof;
- and
- a holder received in said opening in said top of said cell and having a central opening formed by an inner wall of insulating material and adapted to receive a semiconductor wafer to be electroplated so that said wafer is in contact with said electrolytic bath, said inner wall having a plurality of projections adapted to abut a semiconductor wafer received in said central opening of said holder, said holder further having an outer wall of insulating material which defines, in combination with said inner wall, an annular channel, said holder further having a diaphragm ring of electrically conductive material disposed in said annular channel, and said holder further having a plurality of point contacts adapted to hold a semiconductor wafer against said projections of said inner wall, and a cathode terminal electrically connected to said diaphragm plate and to said point contacts.
1 more element
Dependencies are inferred from the claim text.