Semiconductor hall element with magnetic powder in resin
AssigneeKabushiki Kaisha Toshiba
InventorsToshikazu Fukuda, Toshihiro Kato
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Abstract
A highly magnetic Hall element comprising a substrate, a Hall element chip mounted on the substrate, and a magnetic member interposed between the substrate and the chip. The magnetic member increases the coercive force of the element, and is formed by laminating resin layers mixed with powder having a high magnetic permeability, one upon another, by stencil printing on that side of a semiconductor wafer in which a Hall element is mounted. The wafer and the magnetic member are diced together, to provide a Hall element chip. The magnetic member formed on the Hall element chip is adhered to substrate, with half-cured surface put in contact with the substrate.
Claims7
A highly magnetic Hall element comprising:
- a substrate;
- a Hall element chip formed of a semiconductor wafer and mounted over said substrate, said Hall element chip having opposed first and second surfaces;
- a resin layer, including a magnetic powder, situated between the substrate and the first surface of said Hall element chip, a substantial portion of said resin layer being positioned beneath the first surface of said Hall element chip, said resin layer adhering said Hall element chip to said substrate;
- an encap including a resin mixed with a magnetic powder, a substantial portion of said encap being positioned over the second surface of said Hall element chip, magnetic flux passing through said encap and traveling toward the second surface of said Hall element chip, said encap being thickest in a portion corresponding to a center portion of said Hall element chip;
- bonding wires, connecting two pairs of electrodes of said Hall element chip and lead portions of said substrate;
- and
- said sealing material sealing the encap, the Hall element chip, bonding wires, the substrate, and the resin layer.
Dependencies are inferred from the claim text.