Heat sink bus assembly

Abstract

The heat sink bus assembly is adapted to be connected to a printed circuit board having conductor structure leading to conductive foil and printed circuit board mounting structure for physically mounting the printed circuit board components and conduct heat to an enclosure. The printed circuit board is adapted to be mounted in a partially sealed enclosure which is relatively highly thermally conductive. The bus assembly has physically secured thereto high heat generating devices and other devices adjacent to the printed circuit board, is energizable to selectively supply power to a portion of the devices secured thereto, and functions to dissipate heat generated by the high heat generating devices secured thereto by conducting the heat to an enclosure. The bus assembly includes a bus which has relatively high thermal and electrical conductance, and which has bus mounting structure and device securing structure adapted to secure heat generating devices to the bus and to position secured devices to be electrically connected to the conductor structure of the printed circuit board, and mounting means complementary to the bus mounting structure and the printed circuit board mounting structure to mount the bus spaced from but adjacent to the printed circuit board.

Dependencies are inferred from the claim text.