Optical printer head with a light emitting diode array
AssigneeHitachi Cable, Ltd.
InventorsHisao Iizuka, Shigetoshi Hiratsuka, Kiyohiko Tanno, Teruji Satou, Norihiro Ashizuka
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Abstract
An optical printer head with a light emitting diode array comprises means for setting a distance between a light emitting surface of a light emitting diode array chip and a rod lens array. The means is provided with two reference position levels at which the light emitting diode array chip and the rod lens array are held. Therefore, there is no necessity for adjusting the distance between the light emitting diode array chip and the rod lens array so that a productivity thereof is much improved.
Claims8
A substrate with a light emitting diode array comprising:
- electric lead patterns provided on a ceramic substrate,
- a light emitting diode array chip mounted on a first portion of said electric lead patterns provided on said ceramic substrate,
- a driver integrated circuit for driving said light emitting diode array chip, said driver integrated circuit being mounted on a second portion of said electric lead patterns provided on said ceramic substrate, and
- an electric conducting member for decreasing electric resistance of said electric lead patterns, said electric conducting member being mounted on a third portion of said electric lead patterns provided on said ceramic substrate.
A substrate with a light emitting diode array comprising,
- electric lead patterns provided on a first surface of a ceramic substrate,
- a light emitting diode array chip mounted on a first portion of said electric lead patterns provided on said first surface of said ceramic substrate,
- a driver integrated circuit for driving said light emitting diode array chip, said driver integrated circuit being mounted on a second portion of said electric lead patterns provided on said first surface of said ceramic substrate, and
- an electric conducting member for decreasing electric resistance of said electric lead patterns, said electric conducting member being mounted on a second surface of said ceramic substrate and connected through through-holes to said electric lead patterns.
Dependencies are inferred from the claim text.