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US 4,904,761 AGranted
Resin composition for sealing semiconductors
AssigneeMitsui Toatsu Chemicals, Inc.
InventorsYuji Okitsu, Koichi Machida, Motoyuki Torikai, Junko Tsuji, Kotaro Asahina, Kazuya Shinkoda, Takayuki Kubo, Mikio Kitahara
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Abstract
A semiconductor sealing resin composition which comprises (a) a modified epoxy resin which is a graft copolymer of a epoxy resin and a vinyl polymer having dispersed therein a silicone rubber with an average particle diameter less than 1.0.mu.; (b) a curing agent; and (c) an inorganic filler. The sealing composition has a low elastic modulus, a low heat expansion coefficient, a high resistance to heat and a high resistance to thermal expansion.
Claims16
A semiconductor sealing resin composition which comprises;
- (a) a modified epoxy resin which is a graft copolymer of a epoxy resin and a vinyl polymer, said modified epoxy resin having dispersed therein a silicone rubber with an average particle diameter less than 1.0.mu.;
- (b) a curing agent;
- and
- (c) an inorganic filler.
1 more element
Dependencies are inferred from the claim text.