Adhesive and bonding process
AssigneeDenki Kagaku Kogyo Kabushiki Kaisha
InventorsRentaro Suzuki, Shinichiro Ikeda
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Abstract
An adhesive having superior adhesive properties between metal/metal, metal/plastic or plastic/plastic and a bonding process therebetween are provided, which adhesive is composed mainly of a copolymer comprising the respective units of 50 to 95% by weight of vinyl chloride, 5 to 50% by weight of a vinyl carboxylate ester and 0.01 to 5% by weight of a phosphoric acid ester having a C--C double bond and copolymerizable with the foregoing vinyl monomers, and having an average degree of polymerization of 100 to 900, and which bonding process comprises dissolving the adhesive in an organic solvent, coating the solution onto substrates, drying the coated substrate and bonding the substrates onto each other on heating under pressure.
Claims7
An adhesive for use between metallic substrates, between metallic and plastics substrates or between plastics substrates comprising as a main component, a copolymer comprising 50 to 95% by weight of vinyl chloride, 5 to 50% by weight of a vinyl carboxylate ester and 0.01 to 5% by weight of a phosphoric acid ester having a carbon-carbon double bond and copolymerizable with the foregoing vinyl monomers, and having an average degree of polymerization of from 100 to 900.
Dependencies are inferred from the claim text.