Die bonding method
AssigneeKabushiki Kaisha Toshiba
InventorYasuhiko Shimizu
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Abstract
A die bonding method using an adhesive agent for fixedly mounting a semiconductor chip on a substrate of a lead frame, wherein a needle for discharging adhesive agent is moved near the substrate to apply the adhesive agent onto the substrate, and thereafter, the needle and substrate are initially moved apart at a first velocity and then at a second velocity greater than the first velocity.
Claims7
In a die bonding method wherein an adhesive agent with which a semiconductor chip is bonded to a substrate of a lead frame, is discharged from a needle of a die bonding apparatus to the substrate, thereafter the substrate and needle are moved apart and the above operation is repeated for each substrate of the lead frame, said die bonding method comprising:
- after discharge of said adhesive agent, initially using a first velocity for moving said substrate and needle apart;
- and thereafter using a second velocity for moving them apart, said second relative movement velocity being greater than said first relative movement velocity.
Dependencies are inferred from the claim text.