Bonding of FRP parts
AssigneeGenCorp Inc.
InventorsJames F. Beecher, H. William Cocain
Life of this patent
Estimating the term…
Abstract
Cleaning of thermoset FRP part surfaces to be bonded together is accomplished by the application of low intensity, i.e., 0.05 to 10 watts per cm.sup.2, short wavelength ultraviolet radiation in the range of 170 to 300 nm, for a period of time of usually less than 10 seconds which results in removing an effective amount of material, e.g., from about 1 to about 200 angstroms. The cleaning increases the adhesive potential of FRPs to polyurethane adhesives. Furthermore, FRP polymer surfaces treated by this process retain more adhesive strength after aging at elevated temperature in the presence of moisture than untreated surfaces or surfaces washed with isocyanate in MeCl.sub.2. Epoxy adhesives, also, can be used.
Claims4
A process for bonding FRP parts comprising:
- treating at least two thermoset FRP parts for a period of from about 0.1 to about 10 seconds with from about 0.05 to about 10 watts/cm.sup.2 ultraviolet radiation of a short wavelength to remove from about 1 to about 200 angstroms of material to provide cleaned substrate surfaces;
- coating at least one of said cleaned substrate surfaces with an epoxy-based adhesive, a polyurethane-based adhesive, or combinations of said epoxy-based adhesive and said polyurethane-based adhesive;
- joining a said adhesive coated cleaned substrate surface and a said cleaned substrate surface of another said FRP part together so that said adhesive is positioned between two cleaned substrate surfaces of said FRP parts;
- and
- curing and heat treating said adhesive so as to form a bond between said parts.
Dependencies are inferred from the claim text.