Connection to a component for use in an electronics assembly
AssigneeRaychem Corporation
InventorsSvendsen, Leo G., Rebecca A. Leary, Gary I. Geschwind
Life of this patent
Estimating the term…
Abstract
A connection to a contact on an electronic component is made by means of a solder preform in the form of a columm, which comprises a solder body at least partially enclosed within a tubular support. The preform is positioned such that its longitudinal axis is approximately parallel to the plane of the contacts at the point at which it is connected thereto.
Claims39
A component for use in an electronics assembly, comprising:
- (a) a contact;
- and
- (b) a solder preform in the form of a column, which comprises:
- (i) a solder body, and
- (ii) a tubular support, longitudinally and/or radially spaced apart portions of the wall or walls of the support that extend parallel to its longitudinal axis having apertures therein communicating between the interior and the exterior of the support,
- the solder of the body being enclosed at least partially within the support, the apertures being so arranged that when the solder within the support is molten, it is capable of remaining substantially within the support by virtue of its surface tension;
- the preform being connected to the contact by means of a solder connection such that the longitudinal axis of the preform is approximately parallel to the plane of the contact at the point at which the connection between the contact and the preform is made.
A method of making a connection to a component for use in an electronics assembly, comprising:
- (a) providing a first electronic component having a contact to which a connection is to be made, the contact bearing a layer of solder;
- (b) positioning on the contact a solder preform in the form of a column which comprises:
- (i) a solder body, and
- (ii) a tubular support, longitudinally and/or radially spaced apart portions of the wall or walls of the support that extend parallel to its longitudinal axis having apertures therein communicating between the interior and the exterior of the support,
- the solder of the body being enclosed at least partially within the support, the apertures being so arranged that when the solder within the support is molten, it is capable of remaining substantially within the support by virtue of its surface tension;
- the preform being positioned such that its longitudinal axis is approximately parallel to the plane of the contact at the point at which the connection between the contact and the preform is made;
- (c) applying heat to cause the layer of solder on the contact to melt and to wet the preform;
- and
- (d) allowing the solder to solidify.
A method of making a solder preform in the form of a column, which comprises:
- (a) at least partially enclosing a solder body within a tubular support, longitudinally and radially spaced apart portions of the wall or walls of the support that extend parallel to its longitudinal axis having apertures therein communicating between the interior and the exterior of the support, arranged so that when the solder within the support is molten, it is capable of remaining within the support by virtue of its surface tension;
- (b) flattening the preform transversely.
A substantially planar array of solder preforms, each of at least some of which being in the form of a column, and comprising:
- (i) a solder body, and
- (ii) a tubular support, longitudinally and/or radially spaced apart portions of the wall or walls of the support that extend parallel to its longitudinal axis having apertures therein communicating between the interior and the exterior of the support,
- the solder body being enclosed at least partially within the support, and the apertures being so arranged that when the solder within the support is molten, it is capable of remaining substantially within the support by virtue of its surface tension;
- and in which the longitudinal axis of each of at least some of the preforms being approximately parallel to the plane of the array at the point at which it is mounted therein.
Dependencies are inferred from the claim text.