Apparatus for ultrasonic contacting wire connection of circuits to electronic components

In an apparatus for bonding wire connection to electronic components for use in semiconductor connecting technology, particularly for an ultrasonic bonding wire connection of circuits to electronic components, comprising bonding means mounted so as to pivot about an axis and including a first support frame operatively connected to and movable by an electromotive drive, a second support frame, and an energy transducer including a capillary element and received in said second support frame, said capillary element being engageable with individual electronic components to apply wire connection thereto, the improvement comprising a carrier member, said first and second support frames together with said transducer being mounted so as to pivot about an axis Z in said carrier member, and the second support frame with said transducer being additionally movable about an articulation (Z') spaced at a distance (D) from the axis (Z) relative to the first support frame, and wherein for obtaining a necessary positional stability, said first and second frames and said transducer have a common mass center (M) and are pivotable together about the axis (Z) on a symmetry axis (S) within an imaginary circle (E), a center of which is located on an imaginary line formed between the axis (Z) and the articulation (Z').