Slicing machine for cutting semiconductor material
AssigneeMitsubishi Kinzoku Kabushiki Kaisha
InventorsYutaka Kubotera, Kazunari Akiyama
Life of this patent
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Abstract
Slicing machine having a handle to be driven manually to generate command pulses. By revolving the handle, a feedtable is moved at the operator's command, enabling the positioning of a semiconductor material at the right position to start slicing. The thickness of the first wafer cut off from the material as well as other wafers, has a predetermined thickness, so that no wafer is wasted.
Claims8
A slicing machine for cutting semiconductor material into wafers, having a feedtable to be adapted to carry thereon a semiconductor material to be cut, a carrying mechanism which moves the feedtable, a driving circuit which drives the carrying mechanism according to command pulses, a main controller which feeds the command pulses to the driving circuit, and a detection means which detects the position of the feedtable and outputs position data, wherein said slicing machine comprises:
- (a) a handle operatively connected to the feedtable so as to move the feedtable manually;
- (b) a manual pulse generator which produces a series of pulses according to the rotation of the handle;
- and
- (c) a manual pulse controller which transforms the said series of pulses into the command pulses, and supplies the command pulses to the driving circuit.
Dependencies are inferred from the claim text.