Semiconductor device including a resilient bonding resin
AssigneeDirector-General of Agency of Industrial Science and Technology
InventorShuhei Iwade
Life of this patent
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Abstract
A semiconductor device comprising a semiconductor chip attached to a substrate by two kinds of bonding agents, one of which is rigid and disposed at the central region of the semiconductor chip, the other of which is disposed around the rigid bonding agent and which is sufficiently resilient to accommodate thermal expansion differences between the semiconductor chip and the substrate.
Claims5
A semiconductor device comprising a semiconductor chip, a substrate for supporting said semiconductor chip, and bonding means disposed between said semiconductor chip and said substrate for bonding said semiconductor chip onto said substrate for bonding said semiconductor chip onto said substrate, said bonding means comprising a relatively rigid bonding resin disposed between and contacting said semiconductor chip and substrate and a relatively resilient bonding resin disposed between and contacting said semiconductor chip and substrate and enclosing said relatively rigid resin whereby differences in thermal expansion between said semiconductor chip and said substrate are accommodated.
Dependencies are inferred from the claim text.