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US 4,902,750 AGranted
Latent catalysts for heat curable thermosetting resins
AssigneeBASF SE
InventorHong-Son Ryang
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Abstract
The subject invention relates to N-[3-phosphoranylidenyl-1-azacyclopenta-2,4-dione] radical-containing-compounds which are effective, storage stable latent catalysts for a variety of high performance resin systems.
Claims20
A heat-curable resin system, comprising:
- (a) a bismaleimide resin;
- and
- (b) an effective amount of a catalyst which promotes thermal curing of said bismaleimide resin, wherein said catalyst contains at least one N-[3-phosphoranylidenly-1-azacyclopenta-2,4-dione] radical, and having the formula:
- ##STR11## wherein R.sup.1 and each R are individually selected from the group consisting of substituted and unsubstituted alkyl, cycloalkyl, and aryl radicals;
- and wherein X is an organic radical of valence n wherein n is a whole number from 1 to about 4.
2 more elements
A heat-curable resin system, comprising:
- (a) a bismaleimide resin;
- and
- (b) an effective amount of a catalyst which promotes thermal curing of said bismaleimide resin, wherein said catalyst contains at least a compound having the formula ##STR12## wherein each R is individually selected from the group consisting of C.sub.1 -C.sub.10 lower alkyl, C.sub.5 -C.sub.7 cycloalkyl, and C.sub.6 -C.sub.10 aryl.
A heat-curable resin system, comprising:
- (a) bismaleimide resin;
- and
- (b) an effective amount of a catalyst which promotes thermal curing of said bismaleimide resin, wherein said catalyst contains at least one compound having the formula ##STR13## wherein each R is individually selected from the group consisting of C.sub.1 -C.sub.10 lower alkyl, C.sub.5 -C.sub.7 cycloalkyl, and C.sub.6 -C.sub.10 aryl;
- and wherein A is selected from the group consisting ##STR14## and wherein R.sup.2 and R.sub.3 are individually hydrogen, C.sub.1 -C.sub.6 lower alkyl, or phenyl.
1 more element
Dependencies are inferred from the claim text.