Epitaxial process for silicon on insulator structure
AssigneeTexas Instruments Incorporated
InventorsBor-Yen Mao, Richard L. Yeakley
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Abstract
The present invention provides products and methods of forming an epitaxial silicon layer on an implanted buried insulator silicon on insulator structure (10). A silicon film (16) is pre-treated to remove residual oxide and surface damage layers, but in such a way as to not damage the silicon film (16) or insulating layer (14) below the silicon film (16). A layer of amorphous silicon (18) is formed on the silicon film (16) in processes to avoid formation of polycrystalline silicon, and also to avoid damage to the silicon film (16). The layer of amorphous silicon (18) is annealed to form an epitaxial layer of single crystalline silicon (20).
Claims14
A method of forming an epitaxial silicon layer on a single crystalline silicon film which is on an insulating layer, said method comprising:
- implanting oxygen into the surface of a silicon material;
- annealing the silicon material so that a single crystalline film is formed over a layer of silicon dioxide;
- forming a layer of amorphous silicon on said single crystalline silicon film;
- and
- annealing all of said layer of amorphous silicon at substantially the same time to form a layer of single crystalline silicon.
Dependencies are inferred from the claim text.